Rochester, New York Section

Thermal Management for Advanced Computer Systems
Tuesday, October 26, 2004
      1-2 pm
      Xerox Auditorium, College of Engineering, RIT

Hosted by the ASME Rochester Section Heat Transfer Chapter and is free.

      John Magerlein
      Manager, Chip Cooling and RF Passives
      IBM T. J. Watson Research Center
      Yorktown Heights, NY

      Abstract:
The power and power density of advanced computer systems are increasing rapidly along with system performance, leading to severe thermal challenges for chips and modules, racks, and data centers. At the chip level, power densities are beginning to exceed the air-cooling limit of roughly 100 W/cm2. Techniques for increasing the air-cooling limit will be discussed and liquid cooling approaches for even higher power densities will be described. The thermal, mechanical, and acoustic challenges of removing very high power levels from server racks and data centers will also be discussed briefly.

      Biography:
John Magerlein is manager of Chip Cooling and rf Passives at the IBM T. J. Watson Research Center. He received his Ph.D. in physics from the University of Michigan and worked at Bell Laboratories prior to joining IBM. There he has worked on experimental Josephson junction circuits, GaAs MESFET processing and characterization, electronic packaging, and electromagnetic modeling prior to assuming his present position. His present research interests include cooling of very high power microprocessor chips, rf MEMS devices, and advanced electrical and optical packaging for high-performance computer systems. Dr. Magerlein is a member of the American Physical Society and the IEEE.